• Supermicro

Hyper SuperServer SYS-221H-TN24R / 2U

Key Applications

  • Virtualization
  • Software-defined Storage
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server

Key Features

  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
  2. 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600
  3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards
  4. Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. 24x 2.5″ hot-swap NVMe/SATA/SAS drive bays;
    2x internal M.2 NVMe/SATA drive slots;
    Optional RAID support via storage add-on card
  6. 4 heavy duty hot-swap fans with optimal fan speed control

Categories

Download datasheet

Product Specifications

Product SKUs
SuperServer SYS-221H-TN24R
Motherboard
Super X13DEM
Processor
CPU
Core Count Up to 64C/128T; Up to 320MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
  • Supports up to 350W TDP CPUs (Liquid Cooled)
GPU
Max GPU Count Up to 4 double-width or 4 single-width GPU(s)
Supported GPU
CPU-GPU Interconnect PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect PCIe
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM
Memory Voltage 1.1 V
On-Board Devices
SATA SATA3 (6Gbps); RAID 0/1/5/10 support
NVMe NVMe; RAID 0/1/5/10 support (Intel® VROC RAID Key required)
Chipset Intel® C741
Network Connectivity
  • 2x 1GbE BaseT with Intel® i350-AM2 (optional)
  • 4x 1GbE BaseT or 4x 1GbE SFP with Intel® i350-AM4 (optional)
  • 2x 10GbE BaseT with Intel® X550-AT2 (optional)
  • 2x 10GbE SFP+ with Intel® X710-BM2 (optional)
  • 4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
  • 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
  • 2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
  • 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)
  • 2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
  • View AIOM Options
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN 1 RJ45 Dedicated BMC LAN port
USB 2 USB 2.0 port(s) (2 rear)
Video 1 VGA port(s)
System BIOS
BIOS Type AMI 256MB SPI Flash
Management
Software
Power Configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor 2U Rackmount
Model CSE-HS219-R1K63P
Dimensions and Weight
Height 3.5″ (88.9mm)
Width 17.2″ (437mm)
Depth 29.9″ (760mm)
Package 10.4″ (H) x 23.8″ (W) x 43.6″ (D)
Weight
  • Net Weight: 40 lbs (18.2 kg)
  • Gross Weight: 66 lbs (30 kg)
Available Color N/A
Front Panel
Buttons
  • Power On/Off
  • UID button
LEDs
  • HDD activity
  • LAN1 activity
  • Power
  • System information
Expansion Slots
PCI-Express (PCIe)
  • 4 (Optional) PCIe 5.0 x16 or x8 FH, 10.5″L slot(s)
  • 4 (Optional) PCIe 5.0 x8 FH, 10.5″L slot(s)
Note
  • For 16 NVMe configurations, PCIe slots 1,2 and AIOM slot A2 cannot be used.
  • For 24 NVMe configurations, PCIe slots 1,2,5,6 and AIOM slot A2 cannot be used.
Drive Bays / Storage
Hot-swap 24x 2.5″ hot-swap NVMe/SATA/SAS drive bays (NVMe, SATA, or SAS support requires additional parts. Please see the Optional Parts list.)
M.2
System Cooling
Fans 4x 8cm heavy duty fans with optimal fan speed control
Air Shroud 2 Air Shroud(s)
Liquid Cooling Direct to Chip (D2C) Cold Plate (optional)
Power Supply
2x 1600W Redundant Titanium Level power supplies
Dimension (W x H x L) 73.5 x 40 x 265 mm
AC Input
  • 1000W: 100-127Vac / 50-60Hz
  • 1600W: 200-240Vac / 50-60Hz
  • 1600W: 200-240Vdc / 50-60Hz (for CQC only)
+12V
  • Max: 83.3A / Min: 0A (100Vac-127Vac)
  • Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB Max: 3.5A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec. Operating Temperature:
  • 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
  • -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
  • 8% to 90% (non-condensing)
Non-operating Relative Humidity:
  • 5% to 95% (non-condensing)
Environmental / Recycling
Recycle Return Server-End of Life Product

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