Storage servers

Supermicro offers a range of storage server solutions designed for flexibility and scalability to support various applications. These servers are built with the latest technologies, including high-density NVMe and hybrid storage architectures. They cater to different needs, from high-performance AI applications to large-scale object storage, ensuring efficient data management. Supermicro’s storage servers combine revolutionary design with advanced technology to deliver maximum storage capacity and performance.

4U 2 CPU

CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM;LRDIMM;DCPMM
GPU
Storage 36x 3.5″ hot-swap SATA3/SAS3 drive bays (4x 3.5″ NVMe hybrid), 1 M.2 NVMe
Power Supply 1600W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 3200MT/s ECC DDR4 RDIMM;LRDIMM;DCPMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays, 1 M.2 NVMe
Power Supply 1200W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 36C/72T; Up to 54MB Cache per CPU, Supports 120W – 205W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
GPU
Storage 60x 3.5″ hot-swap SATA3/SAS3 drive bays, 2x 2.5″ 7mm drive bays, 2 M.2 NVMe
Power Supply 2600W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 36C/72T; Up to 54MB Cache per CPU, Supports 120W – 205W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
GPU
Storage 60x 3.5″ hot-swap SATA3/SAS3 drive bays, 2x 2.5″ 7mm drive bays, 2 M.2 NVMe
Power Supply 2600W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 36C/72T; Up to 54MB Cache per CPU, Supports 120W – 205W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
GPU
Storage 90x 3.5″ hot-swap SATA3/SAS3 drive bays (4x 2.5″ NVMe dedicated), 2x 2.5″ 7mm drive bays, 2 M.2 NVMe
Power Supply 2600W Redundant Titanium Level power supplies
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports up to 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays (6x 2.5″ NVMe hybrid) (2x 2.5″ hot-swap SATA3 rear drive bays), 2 M.2 NVMe (M-Key, 2280 and 22110)
Power Supply 1200W Redundant Titanium Level power supplies
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports up to 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 36x 3.5″ hot-swap SATA3/SAS3 drive bays (6x 2.5″ NVMe hybrid) (2x 2.5″ hot-swap SATA3 rear drive bays), M.2: 2 M.2 NVMe (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports up to 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays (6x 2.5″ NVMe hybrid) (2x 2.5″ hot-swap SATA3 rear drive bays), 2 M.2 NVMe (M-Key, 2280 and 22110)
Power Supply 1200W Redundant Titanium Level power supplies
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports up to 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 36x 3.5″ hot-swap SATA3/SAS3 drive bays (6x 2.5″ NVMe hybrid) (2x 2.5″ hot-swap SATA3 rear drive bays), 2 M.2 NVMe (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies

4U 1 CPU

CPU Single Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 40C/80T; Up to 60MB Cache, Supports up to 270W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 36x 3.5″ hot-swap SATA/SAS drive bays, M.2: 1x PCIe 3.0 x4 and SATA (M-key, 2280, 22110)
Power Supply 1200W Redundant Titanium Level power supplies
CPU Single Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 40C/80T; Up to 60MB Cache, Supports up to 270W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 45x 3.5″ hot-swap SATA/SAS drive bays, M.2: 1x PCIe 3.0 x4 and SATA (M-key, 2280, 22110)
Power Supply 1600W Redundant Platinum Level power supplies
CPU Single Socket P+ (LGA-4189),3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache, Supports up to 270W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 60x 3.5″ hot-swap SATA3/SAS3 drive bays, M.2: 1x PCIe 3.0 x4 and SATA
Power Supply 1600W Redundant Titanium Level power supplies
CPU Single Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 40C/80T; Up to 60MB Cache, Supports up to 270W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 45x 3.5″ hot-swap SATA/SAS drive bays, M.2: 1x PCIe 3.0 x4 and SATA (M-key, 2280, 22110)
Power Supply 1600W Redundant Platinum Level power supplies
CPU Single Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 40C/80T; Up to 60MB Cache, Supports up to 270W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 36x 3.5″ hot-swap SATA/SAS drive bays, M.2: 1x PCIe 3.0 x4 and SATA (M-key, 2280, 22110)
Power Supply 1200W Redundant Titanium Level power supplies

3U 2 CPU

CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports up to 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 16x 3.5″ hot-swap SATA3/SAS3 drive bays (2x 2.5″ hot-swap SATA3 rear drive bays), 2 M.2 NVMe (M-Key, 2280 and 22110)
Power Supply 1200W Redundant Titanium Level power supplies
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports up to 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 16x 3.5″ hot-swap SATA3/SAS3 drive bays (2x 2.5″ hot-swap SATA3 rear drive bays), M.2: 2 M.2 NVMe (M-Key, 2280 and 22110)
Power Supply 1200W Redundant Titanium Level power supplies

2U 2 CPU

CPU Dual Socket E2 (LGA-4710), Intel® Xeon® 6700 series processors with E-cores, Up to 144C/144T per CPU, Up to 108MB Cache, Supports up to 350W TDP CPUs (Air Cooled)
GPU Up to 2 double-width GPUs, PCIe 5.0 x16 CPU-to-GPU Interconnect, PCIe GPU-GPU Interconnect
Memory 32 DIMM slots, Up to 4TB 6400MT/s (1DPC) or 8TB 5200MT/s (2DPC) ECC DDR5 RDIMM/LRDIMM
Storage 24 front hot-swap E3.S 1T PCIe 5.0 x4 NVMe drive bays, M.2 NVMe support (2 slots, M-key 2280/22110)
Power Supply 2x 2000W Redundant (1 + 1) Titanium Level (96%) power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM;LRDIMM;DCPMM
GPU
Storage 16x 3.5″ hot-swap SATA3/SAS3 drive bays (4x 3.5″ NVMe hybrid), 1 M.2 NVMe
Power Supply 1600W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 3200MT/s ECC DDR4 RDIMM;LRDIMM;DCPMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 12x 3.5″ hot-swap SATA3/SAS3 drive bays (4x 3.5″ NVMe hybrid), 1 M.2 NVMe
Power Supply 1200W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 205W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays (2x 2.5″ hot-swap SATA3 rear drive bays), 2 M.2 NVMe OR 2 M.2 SATA3 (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports 145W – 350W TDP CPUs (Air Cooled)
Memory 32 DIMM slots, Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM
GPU
Storage 24x E3.S Hot-swap NVMe (1T) drive slots, M.2: 2x PCIe 3.0 (Hybrid NVMe or SATA3), (M-Key, 2280 and 22110)
Power Supply 2000W Redundant Titanium Level power supplies
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports up to 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 16x 3.5″ hot-swap SATA3/SAS3 drive bays (6x 2.5″ NVMe hybrid) (2x 2.5″ hot-swap SATA3 rear drive bays), 2 M.2 NVMe (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 205W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays (2x 2.5″ hot-swap SATA3 rear drive bays), M.2: 2 M.2 NVMe OR 2 M.2 SATA3, (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 3200MT/s ECC DDR4 RDIMM;LRDIMM;DCPMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 12x 3.5″ hot-swap SATA3/SAS3 drive bays (4x 2.5″ NVMe hybrid; 4x 3.5″ NVMe hybrid), 1 M.2 NVMe
Power Supply 1200W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 270W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM;LRDIMM;DCPMM
GPU
Storage 16x 3.5″ hot-swap SATA3/SAS3 drive bays (4x 3.5″ NVMe hybrid), 1 M.2 NVMe
Power Supply 1600W Redundant Titanium Level power supplies

2U 1 CPU

CPU Single Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports 150W – 350W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 5600MT/s ECC DDR5 RDIMM/LRDIMM
GPU
Storage 24x 2.5″ hot-swap PCIe 5.0 NVMe drive bays, 2 M.2 NVMe slots
Power Supply 2x 2000W Redundant Titanium Level (96%) power supplies
CPU Single Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 40C/80T; Up to 60MB Cache, Supports up to 270W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 12x 3.5″ hot-swap SATA/SAS drive bays, M.2: 1x PCIe 3.0 x4 and SATA, M-key (2280, 22110)
Power Supply 800W Redundant Titanium Level power supplies
CPU Single Socket SP5, AMD EPYC™ 9004 Series Processor featuring the 3D V-Cache™ Technology, Supports 200W – 290W TDP CPUs (Air Cooled)
Memory 12 DIMM slots, Up to 3TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays, 2 M.2 NVMe (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Single Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports 120W – 300W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays (2x 2.5″ hot-swap SATA3 rear drive bays), 2 M.2 NVMe OR 2 M.2 SATA3 (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Single Socket SP5, AMD EPYC™ 9004 Series Processor featuring the 3D V-Cache™ Technology, Supports 200W – 360W TDP CPUs (Air Cooled)
Memory 24 DIMM slots, Up to 4TB 4800MT/s ECC DDR5 RDIMM/LRDIMM (1DPC), Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM (2DPC)
GPU
Storage 2x 2.5″ hot-swap SATA3 rear drive bays, 32x E3.S Hot-swap NVMe (1T/2T) drive slots, M.2: 2x PCIe 3.0 (NVMe slots) (M-Key, 2280 and 22110)
Power Supply 2000W Redundant Titanium Level power supplies
CPU Single Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports 120W – 300W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 5600MT/s ECC DDR5 RDIMM
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays, 2 M.2 NVMe OR 2 M.2 SATA3, (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Single Socket SP5, AMD EPYC™ 9004 Series Processor featuring the 3D V-Cache™ Technology, Supports 200W – 290W TDP CPUs (Air Cooled)
Memory 12 DIMM slots, Up to 3TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
GPU
Storage 24x 3.5″ hot-swap SATA3/SAS3 drive bays, 2 M.2 NVMe, (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Single Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 40C/80T; Up to 60MB Cache, Supports up to 270W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 12x 3.5″ hot-swap SATA/SAS drive bays, M.2: 1x PCIe 3.0 x4 and SATA, (M-Key, 2280, 22110)
Power Supply 800W Redundant Titanium Level power supplies

2U JBOD

CPU
Memory
GPU
Storage 24x 2.5″ front hot-swap NVMe drive bays, 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110)
Power Supply 2x 1600W Redundant Titanium Level (96%) power supplies
CPU
Memory
GPU
Storage 36x E3.S 1T front hot-swap NVMe drive bays, 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110)
Power Supply 2x 2000W Redundant Titanium Level (96%) power supplies

1U 2 CPU

CPU Dual Socket E2 (LGA-4710), Intel® Xeon® 6700 series processors with E-cores, Up to 144C/144T; Up to 108MB Cache per CPU, Supports up to 300W TDP CPUs (Air Cooled)
Memory 32 DIMM slots, Up to 8TB 5200MT/s ECC DDR5 RDIMM/LRDIMM
GPU Up to 2 single-width GPUs
Storage 16x 1T E3.S front hot-swap NVMe drive bays, 2 M.2 NVMe slots (M-key 2280/22110)
Power Supply 2x 2000W Redundant Titanium Level (96%) power supplies
CPU Dual processor(s) 5th Generation Intel® Xeon® Scalable processors, Supports up to 270W TDP CPUs (Air Cooled)
Memory 32 DIMM slots
GPU
Storage 12x E3.S NVMe drive bays, 2 M.2 NVMe/SATA slots (M-key 2280/22110)
Power Supply 2x 1600W Redundant Titanium Level (96%) power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 205W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
GPU
Storage 12x 3.5″ hot-swap SATA3/SAS3 drive bays, 4x E1.S and 2x 2.5″ 7mm, 2 M.2 NVMe OR 2 M.2 SATA3 (M-Key, 2280)
Power Supply 800W Redundant Platinum Level power supplies (Titanium level in European version)
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports 145W – 270W TDP CPUs (Air Cooled)
Memory 32 DIMM slots, Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM
GPU
Storage 16x E3.S Hot-swap NVMe (1T) drive slots, M.2: 2x PCIe 3.0 (Hybrid NVMe or SATA3), (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Dual Socket E (LGA-4677), 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Supports 145W – 270W TDP CPUs (Air Cooled)
Memory 32 DIMM slots, Up to 8TB 5600MT/s ECC DDR5 RDIMM/LRDIMM
GPU Up to 2 double-width GPU(s)
Storage 24x E1.S Hot-swap NVMe (9.5mm or 15mm) drive slots, M.2: 2x PCIe 3.0 (Hybrid NVMe or SATA3), (M-Key, 2280 and 22110)
Power Supply 2000W Redundant Titanium Level power supplies
CPU Dual Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 38C/76T; Up to 57MB Cache per CPU, Supports 120W – 205W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
GPU
Storage 12x 3.5″ hot-swap SATA3/SAS3 drive bays, 4x E1.S and 2x 2.5″ 7mm, 2 M.2 NVMe OR 2 M.2 SATA3 (M-Key, 2280)
Power Supply 800W Redundant Platinum Level power supplies (European version is Titanium Level)

1U 1 CPU

CPU Single Socket SP5, AMD EPYC™ 9004 Series Processors, Up to 96C/192T, Supports up to 300W TDP CPUs (Air Cooled)
Memory 24 DIMM slots, Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
GPU
Storage 12x 1T E3.S front hot-swap NVMe drive bays, 2 M.2 NVMe slots (M-key 2280/22110)
Power Supply 1x 1600W Redundant Titanium Level (96%) power supply
CPU Single Socket SP5, AMD EPYC™ 9004 Series Processor featuring the 3D V-Cache™ Technology, Up to 96C/192T, Supports 200W – 300W TDP CPUs (Air Cooled)
Memory 24 DIMM slots, Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
GPU
Storage 16x E3.S Hot-swap NVMe (1T/2T) drive slots, M.2: 2x PCIe 3.0 (NVMe slots), (M-Key, 2280 and 22110)
Power Supply 1600W Redundant Titanium Level power supplies
CPU Single Socket P+ (LGA-4189), 3rd Gen Intel® Xeon® Scalable processors, Up to 40C/80T; Up to 60MB Cache, Supports up to 270W TDP CPUs (Air Cooled)
Memory 8 DIMM slots, Up to 2TB 3200MT/s ECC DDR4 RDIMM/LRDIMM, Supports Intel® Optane™ persistent memory 200 series
GPU
Storage 10x 2.5″ hot-swap NVMe drive bays (10x 2.5″ NVMe dedicated), M.2: 2x PCIe 3.0 x4 and SATA, (M-Key, 2280, 22110)
Power Supply 860W Redundant Platinum Level power supplies (Titanium Level for European version)
CPU Single Socket SP3, AMD EPYC™ 7003/7002 Series Processor, Supports 120W – 240W TDP CPUs (Air Cooled)
Memory 16 DIMM slots, Up to 3200MT/s ECC DDR4 RDIMM/LRDIMM
GPU
Storage 12x 3.5″ hot-swap SATA3/SAS3 drive bays, 4x 2.5″ 7mm drive bays, 2 M.2 NVMe (M-Key, 22110)
Power Supply 800W Redundant Platinum Level power supplies

1U JBOD

CPU
Memory
GPU
Storage 32x 2.5″ front hot-swap NVMe drive bays, 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 2280/22110)
Power Supply 2x 1000W Redundant Titanium Level (96%) power supplies