GrandTwin SuperServer SYS-212GT-HNF / 2U

Key Applications

  • Enterprise Applications
  • Scale-Out Object Storage
  • Cloud Computing, Compact Server
  • Web/Hosting Application
  • Cloud Gaming
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • Telco Edge Cloud
  • Mission Critical Web Applications
  • IoT Edge Computing / Gateway
  • Edge AI Inferencing

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Highly configurable 2U 4-Node front access nodes for cold aisle serviceability with up to 8x E1.S NVMe drives per node
  2. 1 PCIe 5.0 x16 LP slot(offering with 4x E1.S drives), or 1 OCP3.0 slot (offering with 2x U.2 drives) for networking expansions
  3. GrandTwin front IO module offers additional networking options (10G/25G/200G) with NCSI support
  4. Single-Socket, Intel® Xeon® 6 6700 series processors
  5. 16 DIMM Slots supporting up to 1TB of memory; ECC RDIMMs up to DDR5-6400

Categories

Product Specifications

Product SKUs SuperServer SYS-212GT-HNF
Motherboard Super X14SBT-G
Processor (per Node)
CPU Single Socket E2 (LGA-4710) Intel® Xeon® 6700 series processors with E-cores
Core Count Up to 144C/144T; Up to 108MB Cache
Note Supports up to 350W TDP CPUs (Air Cooled)
System Memory (per Node)
Memory
  • Slot Count: 16 DIMM slots/2 Channels
  • Max Memory (2DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM
  • View Memory Options
On-Board Devices (per Node)
NVMe
Chipset System on Chip
Network Connectivity
Input / Output (per Node)
LAN 1 RJ45 1 GbE Dedicated BMC LAN port
USB 2 USB 3.0 ports
Video 1 VGA port
System BIOS AMI 64MB Flash ROM
Management
Software
Security
Hardware Trusted Platform Module (TPM) 2.0, Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
FAN Fans with tachometer monitoring, Status monitor for speed control, Pulse Width Modulated (PWM) fan connectors
Temperature Monitoring for CPU and chassis environment
CPU Monitors for CPU Cores, Chipset Voltages, Memory
Chassis 2U Rackmount
Model CSV-GT214E-R3K01TBP
Dimensions and Weight
Height 3.46″ (88 mm)
Width 17.67″ (449 mm)
Depth 28″ (711.2 mm)
Package 9.76″ (H) x 24.65″ (W) x 45.28″ (D)
Weight
  • Gross Weight: 88 lbs (39.9 kg)
  • Net Weight: 68 lbs (30.8 kg)
Available Color Silver
Front Panel
LED HDD activity LED, Network activity LEDs, Power status LED, Universal Information (UID) LED
Buttons Power On/Off button, UID button
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
  • Default: 1 PCIe 5.0 x16 LP slot
  • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
  • View AOC Options
M.2 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default); VROC required for RAID)
Drive Bays / Storage (per Node)
Drive Bays Configuration
  • Default: Total 8 bays, 8 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays
  • Option A: Total 4 bays, 4 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bays
  • Option B: Total 4 bays, 4 front hot-swap 2.5″ PCIe 5.0 x4 NVMe* drive bays
  • Option C: Total 2 bays, 2 front hot-swap 2.5″ PCIe 5.0 x4 NVMe* drive bays
  • (*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)
  • View NVMe Options
M.2 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110(default)/2280; USB 2.0; VROC required for RAID) View M.2 Options
System Cooling
Fans 2x 16K RPM Heavy Duty 8cm Fan(s)
Power Supply
2x 3000W Redundant (1 + 1) Titanium (certification pending) Level (96%) power supplies
Dimension (WxHxL) 106.5 x 84 x 245.3 mm
Input
  • 3000W: 200-240Vac / 50-60Hz
  • 2880W: 240-240Vdc / 50-60Hz (for CQC only)
+12V
  • Max: 250A / Min: 0A (200Vac-240Vac)
  • Max: 240A / Min: 0A (240Vdc-240Vdc) (for CQC safety rating only)
12V SB Max: 3A / Min: 0A
Output Type Backplanes (gold finger)
2x 2200W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 106.5 x 84 x 245.3 mm
Input
  • 100-127Vdc (1200W for the Rest of the World)
  • 1200W: 100-127Vac / 50-60Hz
  • 2090W: 180-220Vac / 50-60Hz (For UL/cUL Only)
  • 200-220Vdc (1800W for the Rest of the World)
  • 200-220Vdc (2090W for North America – UL & cUL)
  • 1800W: 200-220Vac / 50-60Hz
  • 220-230Vdc (1980W for the Rest of the World)
  • 1980W: 220-230Vac / 50-60Hz
  • 220-240Vdc (2200W for North America – UL & cUL)
  • 2200W: 220-240Vac / 50-60Hz (For UL/cUL Only)
  • 230-240Vdc (2090W for the Rest of the World)
  • 2090W: 230-240Vdc / 50-60Hz (for CQC only)
  • 2090W: 230-240Vac / 50-60Hz (for TUV/CB)
+12V
  • Max: 100A / Min: 0A (100Vac-127Vac)
  • Max: 174.17A / Min: 0A (180Vdc-220Vdc) (For UL/cUL only)
  • Max: 174.17A / Min: 0A (180Vac-220Vac) (For UL/cUL Only)
  • Max: 150A / Min: 0A (200Vac-220Vac)
  • Max: 165A / Min: 0A (220Vac-230Vac)
  • Max: 183.3A / Min: 0A (220Vac-240Vac)
  • Max: 183.3A / Min: 0A (220Vac-240Vac) (For UL/cUL only)
  • Max: 174.17A (230Vac-240Vac)
12V SB Max: 2A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
ROHS RoHS Compliant
Environmental Spec.
  • Operating Temperature: 5°C ~ 40°C (41°F ~ 104°F)
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)

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