• Supermicro

FlexTwin SuperServer SYS-222FT-HEA-LCC / 2U

Key Applications

  • Oil & Gas
  • Scientific Research
  • High Performance Computing (HPC)
  • Research Lab

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Dual Intel® Xeon® 6900 Series Processors with P-cores up to 500W with liquid cooling
  2. Up to 24 DIMMs supporting up to 6TB 6400MT/s DDR5 RDIMM or 3TB 8800MT/s DDR5 MRDIMM
  3. Flexible networking with up to 1 OCP 3.0 compatible AIOM slots
  4. Optional 1 PCIe 5.0 x16 FHHL slot + Default 1 PCIe 5.0 x16 LP slot
  5. Optional 2 E1.S Slots + Optional 2 M.2 NVME drive Slots
  6. 4 Redundant Up to 3200W Titanium Level Power Supplies

Categories

Download datasheet

Product Specifications

Product SKUs
SuperServer SYS-222FT-HEA-LCC
Motherboard
Super X14DBT-FAP
Processor (per Node)
CPU
  • Dual Socket BR (LGA-7529)
  • Intel® Xeon® 6900 series processors with P-cores
Core Count Up to 128C/256T; Up to 504MB Cache per CPU
Note
  • Supports up to 500W TDP CPUs (Liquid Cooled)
System Memory (per Node)
Memory
  • Slot Count: 24 DIMM slots
  • Max Memory (1DPC): Up to 6TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (1DPC): Up to 3TB 8800MT/s ECC DDR5 MRDIMM
On-Board Devices (per Node)
NVMe
  • NVMe; RAID 0/1/5/10 support (Intel® VROC RAID key required)
Chipset System on Chip
Network Connectivity
Input / Output (per Node)
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port
USB 2 USB 2.0 Type-A ports (front)
Video 1 VGA port (front)
System BIOS
BIOS Type AMI 64MB SPI Flash
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI/APM Power Management
Security
Hardware Trusted Platform Module (TPM) 2.0, Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
FAN Fans with tachometer monitoring, Status monitor for speed control, Pulse Width Modulated (PWM) fan connectors
Temperature Monitoring for CPU and chassis environment
CPU Monitors for CPU Cores, Chipset Voltages, Memory
Chassis
Form Factor 2U Rackmount
Model CSE-F214EC-000NP
Dimensions and Weight
  • Height: 3.46″ (88 mm)
  • Width: 17.67″ (449 mm)
  • Depth: 37.09″ (942 mm)
  • Package: 10.83″ (H) x 27.29″ (W) x 50.32″ (D)
  • Gross Weight: 129 lbs (58.51 kg)
  • Net Weight: 105 lbs (47.63 kg)
Available Color Silver
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
  • Default: 1 PCIe 5.0 x16 LP slot, 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
  • Option A*: 1 PCIe 5.0 x16 LP slot, 1 PCIe 5.0 x16 AIOM slot, 1 PCIe 5.0 x16 FHHL slot
(*Requires additional parts. See optional parts list.) View AOC Options
Drive Bays / Storage (per Node)
Drive Bays Configuration Option A: Total 2 bays, 2 front hot-swap E1.S NVMe* drive bays (*NVMe support may require additional controller/cables) View Drive Options
M.2 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110; Optional Configuration)
System Cooling
Fans 16x 31K RPM Counter Rotating 40x40x56mm Fan(s)
Liquid Cooling Direct to Chip (D2C) Cold Plate
Power Supply
4x 3200W Redundant (2 + 2) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 185 mm
Input 3200W: 240Vdc / 50-60Hz (for CQC only) 1000W: 100-127Vac / 50-60Hz 2900W: 200-207Vac / 50-60Hz 3000W: 207-220Vac / 50-60Hz 3200W: 220-240Vac / 50-60Hz
+12V Max: 82A / Min: 0A (100Vac-127Vac) Max: 237.7A / Min: 0A (200Vac-207Vac) Max: 245.9A / Min: 0A (207Vac-220Vac) Max: 262.3A / Min: 0A (220Vac-240Vac)
12V SB Max: 3A / Min: 0A
Output Type Backplanes (gold finger)
4x 2000W Redundant (2 + 2) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 203 mm
Input 1000W: 100-127Vac / 50-60Hz 1800W: 200-220Vac / 50-60Hz 2000W: 220-240Vac / 50-60Hz (for UL only) 2000W: 230-240Vdc / 50-60Hz (for China only)
+12V Max: 83A / Min: 0A (100Vac-127Vac) Max: 150A / Min: 0A (200Vac-220Vac) Max: 166A / Min: 0A (230Vac-240Vac)
12V SB Max: 3.5A / Min: 0A
Output Type Backplanes (gold finger)
4x 2700W Redundant (2 + 2) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 203 mm
Input 2700W: 200-240Vac / 50-60Hz 2700W: 240Vdc / 50-60Hz (for CQC only)
+12V Max: 225A / Min: 0A (200Vac-240Vac) Max: 225A / Min: 0A (240Vdc)
12V SB Max: 3.5A / Min: 0A Max: 4A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
ROHS RoHS Compliant
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)

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