• Supermicro

BigTwin SuperServer SYS-622BT-HNC8R / 2U

Key Applications

  • Hyperconverged Infrastructure
  • Scale-Out File Storage
  • Back-up & Recovery

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
    • Dual Socket E2 Intel® Xeon® 6 6700 processors with E-cores up to 165W with air cooling or 330W with liquid cooling
    • Single CPU configurations supported while maintaining all expansion slot functionality
  2. Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC
  3. Flexible networking with OCP 3.0 AIOM slot
    • Up to 2 PCIe 5.0 x16 LP slots; Tool-less support
    • Internal PCIe 5.0 for 2x NVMe M.2 support onboard
    • Optional 4x NVMe M.2 support onboard with built-in HW RAID1 via SCC-A2NM2241GH-B1
    • Up to 3 front hot-swap 3.5″ NVMe/SAS drive bays
    • Built-in SAS3 Support via Broadcom 3808; IT Mode

Categories

Download datasheet

Product Specifications

Product SKUs SuperServer SYS-622BT-HNC8R
Motherboard Super X14DBT-B
Processor (per Node)
CPU Dual Socket E2 (LGA-4710) Intel® Xeon® 6700 series processors with E-cores
Core Count Up to 144C/144T; Up to 108MB Cache per CPU
Note
  • Supports up to 165W TDP CPUs (Air Cooled)*
  • Supports up to 330W TDP CPUs (Liquid Cooled)
  • *Air Cooled CPUs with TDP over 165W only supported under specific conditions. Contact a Supermicro representative for details.
System Memory (per Node)
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (1DPC): Up to 2TB 6400MT/s ECC DDR5 RDIMM
  • View Memory Options
On-Board Devices (per Node)
SAS SAS (12Gbps) via Broadcom® 3808; (IT mode)
Chipset System on Chip
Network Connectivity
Input / Output (per Node)
LAN 1 RJ45 1 GbE Dedicated BMC LAN port
USB 2 USB 3.0 Type-A ports (Rear)
Video 1 VGA port
System BIOS AMI 32MB SPI Flash
Management
Software
Power configurations Power-on mode for AC power recovery, ACPI Power Management
Security
Hardware Trusted Platform Module (TPM) 2.0, Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU Monitors for CPU Cores, Chipset Voltages, Memory
FAN Fans with tachometer monitoring, Status monitor for speed control, Pulse Width Modulated (PWM) fan connectors
Temperature Monitoring for CPU and chassis environment, Thermal Control for fan connectors
Chassis 2U Rackmount
Model CSE-827BQ2-R3K60P
Dimensions and Weight
Height 3.47″ (88 mm)
Width 17.68″ (449 mm)
Depth 30.5″ (774 mm)
Package 9.76″ (H) x 24.65″ (W) x 45.28″ (D)
Weight
  • Gross Weight: 96.6 lbs (43.8 kg)
  • Net Weight: 66.1 lbs (30 kg)
Available Color Black front & silver body
Front Panel
LED
  • HDD activity LED
  • Network activity LEDs
  • Power status LED
  • Universal Information (UID) LED
Buttons
  • Power On/Off button
  • UID button
Expansion Slots (per Node)
PCI-Express (PCIe) Configuration
  • 2 PCIe 5.0 x16 LP slots
  • 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
  • View AOC Options
Drive Bays / Storage (per Node)
Drive Bays Configuration
M.2 2 M.2 PCIe 5.0 x4 NVMe slots (M-key 22110; VROC required for RAID)
System Cooling
Fans 4x 14.9K RPM Heavy Duty 80x80x38mm Fan(s)
Liquid Cooling Direct to Chip (D2C) Cold Plate (optional)
Power Supply
2x 3600W Redundant (1 + 1) Titanium Level (96%) power supplies
  • Dimension (WxHxL): 45 x 40 x 480 mm
  • Input
    • 3600W: 0240Vdc / 50-60Hz (for CQC only)
    • 1400W: 100-127Vac / 50-60Hz
    • 3000W: 200-207.9Vac / 50-60Hz
    • 3100W: 208-219.9Vac / 50-60Hz
    • 3250W: 220-229.9Vac / 50-60Hz
    • 3450W: 230-237.9Vac / 50-60Hz
    • 3600W: 238-240Vac / 50-60Hz
  • +12V
    • Max: 112A / Min: 0A (100Vac-127Vac)
    • Max: 240A / Min: 0A (200Vac-207.9Vac)
    • Max: 248A / Min: 0A (208Vac-219.9Vac)
    • Max: 260A / Min: 0A (220Vac-229.9Vac)
    • Max: 276A / Min: 0A (230Vac-237.9Vac)
    • Max: 288A / Min: 0A (238Vac-240Vac)
  • 12V SB: Max: 4.5A / Min: 0A
  • Output Type: Backplanes (gold finger)
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)

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