UP SuperServer SYS-111E-WR / 1U

Key Applications

  • Virtualization
  • Cloud Computing
  • Data Center Optimized
  • Database/Storage
  • Entry GPU server

Key Features

  1. Single Socket E (LGA-4677) 4th/5th Gen Intel®  Xeon® Scalable processors. Up to 300W TDP
  2. Intel® C741 Chipset
  3. 8 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz
  4. 2 PCIe 5.0 x16 FHFL;
    1 PCIe 5.0 x8(in x16) LP;
    1 PCIe 3.0 x2 NVMe M.2
  5. Onboard 1G LAN ports (Intel® i210), 1 dedicated IPMI LAN
  6. 10x front hot-swap 2.5″ SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
  7. Redundant Now Titanium 860W Power Supplies

Categories

Product Specifications

Product SKUs
SuperServer SYS-111E-WR
Motherboard
Super X13SEW-F
Processor
CPU
Core Count Up to 52C/104T; Up to 300MB Cache
Note Supports up to 300W TDP CPUs (Air Cooled)
GPU
Max GPU Count Up to 1 double-width or 2 single-width GPU(s)
Supported GPU
CPU-GPU Interconnect PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect PCIe
System Memory
Memory
  • Slot Count: 8 DIMM slots/8 Channels
  • Max Memory (1DPC): Up to 2TB 4800MT/s ECC DDR5 RDIMM
Memory Voltage 1.1 V
On-Board Devices
SATA SATA3 (6Gbps); RAID 0/1/5/10 support
Chipset Intel® C741
Network Connectivity 2x 1GbE BaseT with Intel® i210
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
SATA 10 SATA (6Gbps) port(s)
LAN
  • 1 RJ45 Dedicated IPMI LAN port
  • 2 RJ45 1GbE LAN ports
USB
  • 4 USB 3.2 Gen 1 port(s) (2 front; 2 rear)
  • 3 USB 2.0 port(s) (2 rear; 1 Type A)
Video 1 VGA port(s)
Serial Port 2 COM Port(s) (1 header; 1 rear)
System BIOS
BIOS Type AMI 32MB SPI Flash EEPROM
Management
Software
Power Configurations ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 8 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor 1U
Model CSE-116BTS-R000WNP
Dimensions and Weight
Height 1.7″ (43mm)
Width 17.2″ (437mm)
Depth 23.5″ (597mm)
Package 7.75″ (H) x 23.5″ (W) x 31.5″ (D)
Weight
  • Net Weight: 21 lbs (9.53 kg)
  • Gross Weight: 33.5 lbs (15.2 kg)
Available Color Black
Expansion Slots
PCI-Express (PCIe)
  • 2 PCIe 5.0 x16 FHFL slot(s)
  • 1 PCIe 5.0 x8 (in x16) LP slot(s)
Note Acronyms: (FH = Full Height, LP = Low Profile, FL = Full Length, HL = Half Length)
Drive Bays / Storage
Drive Bays 10x 2.5″ NVMe/SATA/SAS drive bays (10x 2.5″ NVMe hybrid)
M.2
System Cooling
Fans
  • 1 AOC cooling Fan(s) (optional)
  • 5 middle cooling PWM 40x40x56mm Fan(s)
Power Supply
2x 860W Redundant Titanium Level power supplies
Dimension (W x H x L) 54.5 x 40.25 x 322 mm
AC Input
  • 800W: 100-127Vac / 50-60Hz
  • 860W: 200-240Vac / 50-60Hz
  • 860W: 240Vdc / 50-60Hz
+12V
  • Max: 66.67A / Min: 0A (100Vac-127Vac)
  • Max: 71.67A / Min: 0A (200Vac-240Vac)
  • Max: 71.67A / Min: 0A (Vdc-240Vdc)
5V SB Max: 4A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec. Operating Temperature:
  • 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
  • -30°C to 60°C (-22°F to 140°F)
Operating Relative Humidity:
  • 8% to 80% (non-condensing)
Non-operating Relative Humidity:
  • 8% to 90% (non-condensing)

Speak with an expert to learn more.