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IoT SuperServer SYS-220HE-FTNR / 2U | Taknet
  • Supermicro

IoT SuperServer SYS-220HE-FTNR / 2U

Key Applications

  • 5G Core and Edge
  • Telecom Micro Data Center
  • AI Inference and Machine Learning
  • Network Function Virtualization
  • Cloud Computing

Key Features

  1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  2. 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
  3. 3 PCIe 4.0 x16 slots with GPU/Accelerator support (Default);
    1 PCIe 4.0 x16 expansion slots (Optional)
  4. Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. Up to 6x 2.5″ hot-swap drive bays with options to support NVMe/SATA drives
  6. 6 heavy duty hot-swap fans with optimal fan speed control Front I/O, tool-less design
  7. Redundant 2000W redundant AC power supplies

Categories

Download datasheet

Product Specifications

Product SKUs
SuperServer SYS-220HE-FTNR
Motherboard
Super X12DHM-6
Processor
CPU
  • Dual Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
Note
Supports up to 270W TDP CPUs (Air Cooled)
GPU
Max GPU Count Up to 3 double-width or 3 single-width GPU(s)
Supported GPU
CPU-GPU Interconnect PCIe 4.0 x16 CPU-to-GPU Interconnect
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
Memory Voltage 1.2 V
On-Board Devices
SATA SATA3 (6Gbps); RAID 0/1/5/10 support
NVMe NVMe; RAID 0/1/5/10 support (Intel® VROC RAID Key required)
Chipset Intel® C621A
Network Connectivity
  • 2x 1GbE BaseT with Intel® i350-AM2 (optional)
  • 4x 1GbE SFP or 2x 10GbE BaseT with Intel® X550-AT2 (optional)
  • 2x 10GbE SFP+ with Intel® X710-BM2 (optional)
  • 4x 10GbE SFP+ with Intel® XL710-BM1 (optional)
  • 4x 10GbE RJ45/SFP+ with Intel® X710-TM4 (optional)
  • 2x 25GbE SFP28 with Broadcom® BCM57414 (optional)
  • 4x 25GbE RJ45/SFP28 with Mellanox® CX-4 Lx EN Intel® X550-AT2 (optional)
  • 2x 100GbE QSFP28 with Broadcom® BCM57508 (optional)
  • 4x 1GbE BaseT with Intel® i350-AM4 (optional)
  • View AIOM Options
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN 1 RJ45 Dedicated BMC LAN port
USB 2 USB 2.0 port(s) (2 front)
Video 1 VGA port(s)
System BIOS
BIOS Type AMI 256MB SPI Flash
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
CPU
Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor 2U Rackmount
Model CSE-HE211-R000NFP
Note Standard sliding rail kit: Post to Post 19.1″ ~ 26.4“
Dimensions and Weight
Height 3.5″ (88.9mm)
Width 17.2″ (436.88mm)
Depth 22.6″ (574mm)
Package 9.7″ (H) x 23.5″ (W) x 36.9″ (D)
Weight
  • Net Weight: 34.4 lbs (15.6 kg)
  • Gross Weight: 47.4 lbs (21.5 kg)
Available Color Silver
Front Panel
Buttons
  • Power On/Off
  • UID button
LEDs
  • HDD activity LED
  • LAN1 activity
  • LAN2 activity
  • Power Fail
  • Power status LED
  • System information
Expansion Slots
PCI-Express (PCIe)
  • 3 PCIe 4.0 x16 or x8 FHFL slot(s)
  • 1 PCIe 4.0 x8 FHFL slot(s)
  • 2 PCIe 4.0 x8FHFL slot(s)
  • 1 PCIe 4.0 x8 or (Optional) x16 FHHL slot(s)
  • 1 PCIe 4.0 x8 FHHL or slot(s)
Note
If Slot 1 is configured as PCIe x16, Slot 2 will be disabled; If Slot 3 is configured as PCIe x16, Slot 4 will be disabled; If Slot 5 is configured as PCIe x16, Slot 6 will be disabled; (Optional) If Slot 7 is configured as PCIe x16, Slot 8 will be disabled.
Drive Bays / Storage
Hot-swap
6x 2.5″ hot-swap NVMe/SATA/SAS drive bays (6x 2.5″ NVMe hybrid)
M.2
System Cooling
Fans 6 Counter-rotating, Hot-swappable 60x60x56mm Fan(s)
Power Supply
2000W Redundant Titanium (certification pending) Level power supplies
Dimension (W x H x L) 73.5 x 40 x 203 mm
AC Input
  • 1000W: 100-127Vac / 50-60Hz
  • 1800W: 200-220Vac / 50-60Hz
  • 1980W: 220-230Vac / 50-60Hz
  • 2000W: 220-240Vac / 50-60Hz (for UL only)
  • 2000W: 230-240Vac / 50-60Hz
  • 2000W: 230-240Vdc / 50-60Hz (for China only)
+12V
  • Max: 83A (100Vac-127Vac)
  • Max: 150A (200Vac-220Vac)
  • Max: 165A (220Vac-230Vac)
  • Max: 166A (230Vac-240Vac)
12V SB Max: 3.5A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec. Operating Temperature:
  • 5°C ~ 35°C (41°F ~ 95°F)
Non-operating Temperature:
  • -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
  • 8% to 90% (non-condensing)
Non-operating Relative Humidity:
  • 5% to 95% (non-condensing)

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