Hyper SuperServer SYS-212H-TN / 2U

Key Applications

  • Virtualization
  • Software-defined Storage
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server
  • Data Center Optimized
  • Database Processing and High Density Storage

Key Features

  1. Hyper is a flagship performance rackmount server designed for scale-out cloud workloads.
  2. Single Intel® Xeon® 6 Processor.
  3. 16 DIMM slots supporting up to 2TB of memory (6700E series CPU).
  4. Double width add-on card support.
  5. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible).
  6. Breeze through high throughput workloads with PCIe 5.0 NVMe drive support.
  7. Trusted Platform Module (TPM) 2.0 onboard.
  8. Modularized and Tool-less design for easy serviceability.

Categories

Product Specifications

Product SKUs
SuperServer SYS-212H-TN
Motherboard
Super X14SBH
Processor
CPU
  • Single Socket E2 (LGA-4710)
  • Intel® Xeon® 6700 series processors with E-cores
Core Count Up to 144C/144T; Up to 108MB Cache
Note Supports up to 330W TDP CPUs (Air Cooled)
GPU
Max GPU Count Up to 1 double-width or 2 single-width GPUs
CPU-GPU Interconnect PCIe 5.0 x16 CPU-to-GPU Interconnect
System Memory
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (1DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 2TB 5200MT/s ECC DDR5 RDIMM
  • View Memory Options
On-Board Devices
NVMe
Chipset System on Chip
Network Connectivity
Input / Output
LAN 1 RJ45 1 GbE Dedicated BMC LAN port
USB 2 USB 3.0 ports (rear)
Video 1 VGA port
System BIOS
BIOS Type AMI 64MB SPI Flash
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware Trusted Platform Module (TPM) 2.0, Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature Monitoring for CPU and chassis environment, Thermal Control for fan connectors
 
Chassis
Form Factor 2U Rackmount
Model CSE-HS201-R000NFP
Dimensions and Weight
Height 3.5″ (88.9 mm)
Width 17.2″ (437 mm)
Depth 31.74″ (806.2 mm)
Package 9.96″ (H) x 26.46″ (W) x 43.31″ (D)
Weight Gross Weight: 75 lbs (34 kg), Net Weight: 45 lbs (20.5 kg)
Available Color Silver
Front Panel
LED HDD activity, LAN1 activity, Power status, System information
Buttons Power On/Off, UID button
Expansion Slots
PCI-Express (PCIe) Configuration
  • Option A: 1 PCIe 5.0 x16 FHFL double-width slot, 1 PCIe 5.0 x16 FH/10.5″L double-width slot, 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
  • Option B: 1 PCIe 5.0 x16 FHFL double-width slot, 2 PCIe 5.0 x8 FH/10.5″L slots, 1 PCIe 5.0 x16 AIOM slot (OCP 3.0 compatible)
  • View AOC Options
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 8 bays – 8 front hot-swap 2.5″ NVMe*/SAS*/SATA* drive bays
  • Option A: Total 16 bays – 8 front hot-swap 2.5″ PCIe 5.0 x4 NVMe* drive bays, 8 front hot-swap 2.5″ SAS*/SATA* drive bays
  • Option B: Total 16 bays – 16 front hot-swap 2.5″ SAS*/SATA* drive bays
  • Option C: Total 24 bays – 24 front hot-swap 2.5″ SAS*/SATA* drive bays
  • View NVMe Options, View Drive Options
M.2
  • 2 M.2 NVMe slots (M-key 2280/22110/25110; VROC required for RAID)
  • View M.2 Options
System Cooling
Fans 6 counter-rotating 60x60x56mm Fan(s)
Air Shroud 1 CPU Air Shroud
Power Supply
2x 1200W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 265 mm
Input 800W: 100-127Vac 800W: 100-127Vac / 50-60Hz 1200W: 200-240Vac 1200W: 200-240Vac / 50-60Hz 1200W: 230-240Vdc / 50-60Hz (for CCC only)
+12V Max: 66.7A / Min: 0A (100Vac-127Vac) Max: 83A / Min: 0A (100Vac-127Vac) Max: 100A / Min: 0A (200Vac-240Vac) Max: 100A / Min: 0A (230Vdc-240Vdc) (for CCC only)
12V SB Max: 2.1A / Min: 0A
Output Type Backplanes (gold finger)
2x 1300W Redundant (1 + 1) Gold (Certification Pending) Level power supplies
Dimension (WxHxL) 73.5 x 40 x 265 mm
Input 1300W: -44–65Vdc
+12V Max: 108.3A / Min: 0A
12V SB Max: 2.1A
Output Type Backplanes (gold finger)
2x 1600W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 265 mm
Input 1000W: 100-127Vac 1000W: 100-127Vac / 50-60Hz 1600W: 200-240Vac 1600W: 200-240Vac / 50-60Hz 1600W: 200-240Vdc / 50-60Hz (for CQC only)
+12V Max: 83.3A / Min: 0A (100Vac-127Vac) Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB Max: 3.5A / Min: 0A
Output Type Backplanes (gold finger)
2x 2600W Redundant (1 + 1) Titanium Level (96%) power supplies
Dimension (WxHxL) 73.5 x 40 x 265 mm
Input 2600W: 200-240Vac 2600W: 200-240Vdc (For CQC Only) 2600W: 200-240Vac / 50-60Hz 2600W: 200-240Vdc / 50-60Hz (for CQC only)
+12V Max: 216A / Min: 0A (11.4Vdc-12.6Vdc) (12V output) Max: 216A / Min: 0A (200Vac-240Vac)
12V SB Max: 3.5A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec. Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F), Non-operating Temperature: -40°C to 70°C (-40°F to 158°F), Operating Relative Humidity: 8% to 90% (non-condensing), Non-operating Relative Humidity: 5% to 95% (non-condensing)

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