GPU SuperServer SYS-220GP-TNR 2U

Key Applications

  • Scientific Virtualization
  • High Performance Computing
  • VDI
  • AI/Deep Learning Training

Key Features

  1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  2. Intel® C621A Chipset
  3. 16 DIMM Slots;
    Up to 4TB DRAM;
    Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM);
    3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
    Intel® Optane™ Persistent Memory 200 series
  4. 6 PCIe Gen 4.0 x16 FH, 10.5″ L
    Up to 2 PCIe Gen 4.0 x8 FH
  5. Flexible networking options
  6. 2x M.2 NVMe for boot drive only (with optional expansion card AOC-SLG3-2M2)
    Configuration 1: 8x SATA + 2x NVMe (PCIe slot 7 + slot 8 enabled)
    Configuration 2: 6x SATA + 4x NVMe (PCIe slot 7 enabled)
    Configuration 3: 4x SATA + 6x NVMe
    Total 10x 2.5″ Hot-swap drive bays, configurable combination of SATA + NVMe with optional cable, up to 6x NVMe
  7. 5 counter rotating fans w/ Optimal Fan Speed Control
  8. 2x 2600W redundant Titanium level power supplies

Categories

Product Specifications

Product SKUs
SuperServer SYS-220GP-TNR
Motherboard
Super X12DPG-AR
Processor
CPU
  • Dual Socket P+ (LGA-4189)
  • 3rd Gen Intel® Xeon® Scalable processors
Core Count Up to 40C/80T; Up to 60MB Cache per CPU
Note
Supports up to 270W TDP CPUs (Air Cooled)
GPU
Max GPU Count Up to 6 double-width or 8 single-width GPU(s)
Supported GPU
  • NVIDIA PCIe: A30,A2,A10,A40,RTX A5000,RTX A4000,A16,A100,RTX A6000,RTX A4500,A40
  • View GPU Options
CPU-GPU Interconnect PCIe 4.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect PCIe
Certification
System Memory
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (2DPC): Up to 4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
  • Supports Intel® Optane™ persistent memory 200 series
Memory Voltage 1.2 V
On-Board Devices
SATA SATA3 (6Gbps); RAID 0/1/5/10 support
Chipset Intel® C621A
Network Connectivity
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
Video 1 VGA port(s)
System BIOS
BIOS Type AMI 32MB SPI Flash EEPROM
Management
Software
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • System Lockdown
PC Health Monitoring
CPU
  • 7 +1 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor 2U Rackmount
Model CSE-218GH2TS-R2K63BP
Dimensions and Weight
Height 3.46″ (88mm)
Width 17.35″ (440.7mm)
Depth 30.18″ (766.8mm)
Package 11″ (H) x 26.5″ (W) x 44.5″ (D)
Weight
  • Net Weight: 39.5 lbs (17.9 kg)
  • Gross Weight: 54 lbs (24.5 kg)
Available Color Black Front & Silver Body
Front Panel
Buttons
Power On/Off button
LEDs
  • Hard drive activity LED
  • Information LED
  • Network activity LEDs
  • Power status LED
  • UID LED
Expansion Slots
PCI-Express (PCIe)
  • 6 PCIe 4.0 x16 FH 10.5″ L slot(s)
  • 2 PCIe 4.0 x8 FHFL slot(s)
Drive Bays / Storage
Hot-swap 10x 2.5″ hot-swap NVMe/SATA/SAS drive bays (2x 2.5″ NVMe dedicated)
M.2
System Cooling
Fans 5 heavy duty fans with optimal fan speed control
Power Supply
2600W Redundant Titanium Level power supplies
Dimension (W x H x L) 73.5 x 40 x 265 mm
AC Input
  • 2600W: 200-240Vac / 50-60Hz
  • 2600W: 200-240Vdc / 50-60Hz (for CQC only)
+12V
Max: 216A / Min: 0A (200Vac-240Vac)
12V SB Max: 3.5A
Output Type Backplanes (gold finger)
Operating Environment
Environmental Spec. Operating Temperature:
  • 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
  • -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
  • 8% to 90% (non-condensing)
Non-operating Relative Humidity:
  • 5% to 95% (non-condensing)

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