• Supermicro

A+ Server AS-2124GQ-NART+ / 4U

Key Applications

  • AI/ML, Deep Learning Training and Inference
  • High-performance Computing (HPC)
  • Cloud Computing
  • Research Laboratory/National Laboratory
  • Autonomous Vehicle Technologies
  • Molecular Dynamics Simulation

Key Features

  1. High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)
  2. Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
  3. Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
  4. On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN
  5. Dual AMD EPYC™ 7003/7002 Series Processors
    (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
  6. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
  7. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)
  8. 4 Hot-swap 2.5″ drive bays (SAS/SATA/NVMe Hybrid)
  9. 3000W Redundant Titanium Level (96%+) Power Supplies
    (full redundancy based on 40GB HGX A100 4-GPU configuration ONLY and application load)

Categories

Download datasheet

Product Specifications

Product SKUs
AS -2124GQ-NART+ A+ Server 2124GQ-NART+ (Black)
Motherboard
Super H12DSG-Q-CPU6
Processor/Cache
CPU
  • Dual AMD EPYC™ 7003/7002 Series Processors
  • (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
  • Socket SP3
  • Supports CPU TDP up to 280W*
Cores Up to 128 Cores (64 per CPU)
Note * Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
GPU Support Supports HGX A100 4-GPU 40GB (HBM2) or 80GB(HBM2e) with NVLink GPU interconnect and PCI-E Gen4 host CPUs
GPU
Supported GPUs HGX A100 4-GPU 40GB/80GB SXM4 Multi-GPU Board
CPU-GPU Interconnect PCI-E Gen 4 x16 Direct Connect CPU-GPU Dual-Root
GPU-GPU Interconnect NVIDIA® NVLink™ GPU-to-GPU Interconnect
System Memory
Memory Capacity
  • 32 DIMM slots
  • Up to 8TB 3DS ECC DDR4-3200MH SDRAM
Memory Type 3200MHz ECC DDR4 SDRAM
On-Board Devices
Chipset System on Chip (SoC)
Network Dual RJ45 10GbE-aggregate host LAN, RJ45 1GbE IPMI
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics & System Management ASPEED AST2600 BMC
Input / Output
SATA 4 SATA3 (6Gbps) ports
LAN
  • 2 RJ45 10GbE-aggregate host LAN ports
  • 1 RJ45 1GbE Dedicated IPMI management port
USB 2 USB 3.0 ports (rear)
Video 1 VGA Connector (rear)
Others
  • 1 COM port (header)
  • 1 TPM 2.0 (header)
System BIOS
BIOS Type AMI 256Mb SPI Flash ROM
Management
Software
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor 2U Rackmountable
Model CSE-228GTS-R3K02P
Dimensions
Height 3.5″ (89mm)
Width 17.2″ (437mm)
Depth ~32.7″ (830.3mm)
Weight
  • Net Weight: 78.5 lbs (35.6 kg)
  • Gross Weight: 88.5 lbs (40.1 kg)
Package Dimensions 45.5″ L x 22.5″ W x 11″ H
Available Colors Black
Drive Bays / Storage
Hot-swap 4 Hot-swap 2.5″ drive bays (SATA/NVMe Hybrid or SAS with optional HBA)
Expansion Slots
PCI-Express
  • 4 PCI-E Gen4 x16 (LP) slots – supporting HGX A100 4-GPU’s 1:1 connection to 4 NICs
  • 1 PCI-E Gen 4 x8 (LP) slot
System Cooling
Fans 4 Hot-swap heavy duty fans
Power Supply
3000W Redundant Titanium Level Power Supplies
Dimension (W x H x L) 106.5 x 82.4 x 203.5 mm
Certification Titanium Level 96% Titanium Level
Operating Environment
RoHS RoHS Compliant
Environmental Spec. Operating Temperature:
  • 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
  • -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
  • 8% to 90% (non-condensing)
Non-operating Relative Humidity:
  • 5% to 95% (non-condensing)

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