• Supermicro

Storage A+ Server ASG-2115S-NE332R / 2U

Key Applications

  • Software-defined Storage
  • In-Memory Computing
  • Data Intensive HPC
  • Private & Hybrid Cloud
  • NVMe Over Fabrics Solution

Key Features

  1. Single Socket SP5 AMD EPYC™ 9004 Series processors. Up to 360W TDP.
  2. Supports 24 DIMMs with 2DPC, up to 6TB memory capacity with 24 DIMMs of 256GB 3DS RDIMM/RDIMM DDR5 ECC memory
  3. Two PCIe 5.0 x16 slots & two AIOM connectors (OCP 3.0 SFF compliant)
  4. 32x hot-swap E3.S (7.5mm) NVMe drive bays
  5. Redundant Titanium 2000W Power Supplies

Categories

Download datasheet

Product Specifications

Product SKUs
A+ Server ASG-2115S-NE332R
Motherboard
Super H13SSF
Processor
CPU
Note Supports 200W – 360W TDP CPUs (Air Cooled)
System Memory
Memory
  • Slot Count: 24 DIMM slots
  • Max Memory (1DPC): Up to 4TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
  • Max Memory (2DPC): Up to 6TB 4800MT/s ECC DDR5 RDIMM/LRDIMM
Memory Voltage 1.1 V
On-Board Devices
Chipset AMD System on Chip
Network Connectivity
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output
LAN 1 RJ45 Dedicated IPMI LAN port
USB 4 USB 3.0 port(s) (2 front; 2 rear)
Video 1 VGA port(s)
System BIOS
BIOS Type AMI 32MB SPI Flash EEPROM
Management
Software
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 4+1 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor 2U Rackmount
Model CSE-236E3-R2K08P
Dimensions and Weight
Height 3.5″ (89.8mm)
Width 17.2″ (438.4mm)
Depth 30.8″ (789.9mm)
Package 10″ (H) x 26.5″ (W) x 43.25″ (D)
Weight
  • Net Weight: 55 lbs (24.95 kg)
  • Gross Weight: 77 lbs (34.93 kg)
Available Color Silver
Expansion Slots
PCI-Express (PCIe)
  • 2 PCIe 5.0 x16 FH slot(s)
  • 2 PCIe 5.0 x16 AIOM slot(s)
Drive Bays / Storage
Hot-swap
  • (2x 2.5″ hot-swap SATA3 rear drive bays)
  • 32x E3.S Hot-swap NVMe (1T/2T) drive slots
M.2
System Cooling
Fans 4 Heavy Duty 8cm Fan(s)
Power Supply
2000W Redundant Titanium Level power supplies
Dimension (W x H x L) 73.5 x 40 x 203 mm
AC Input
  • 1000W: 100-127Vac / 50-60Hz
  • 1800W: 200-220Vac / 50-60Hz
  • 1980W: 220-230Vac / 50-60Hz
  • 2000W: 220-240Vac / 50-60Hz (for UL only)
  • 2000W: 230-240Vac / 50-60Hz
  • 2000W: 230-240Vdc / 50-60Hz (for China only)
+12V
  • Max: 83A / Min: 0A (100Vac-127Vac)
  • Max: 150A / Min: 0A (200Vac-220Vac)
  • Max: 165A / Min: 0A (220Vac-230Vac)
  • Max: 166A / Min: 0A (230Vac-240Vac)
12V SB Max: 3.5A
Output Type Backplanes (gold finger)
Operating Environment
RoHS RoHS Compliant
Environmental Spec. Operating Temperature:
  • 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
  • -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
  • 8% to 90% (Non-Condensing)
Non-operating Relative Humidity:
  • 5% to 95% (Non-Condensing)

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